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| High Performance BGA Cooling Solutions w/ superGRIPTM Attachment ATS PART # ATS-X50190B-C1-R0 Features & Benefits Designed for 19 x 19 mm BGA components requires minimal space around the component's perimeter; ideal for densely populated PCBs Allows the heat sink to be detached and reattached without damaging the component or the PCB, an important feature in the event a PCB may need to be reworked Strong, uniform attachment force helps achieve maximum performance from phase-changing TIMs Eliminates the need to drill mounting holes in the PCB Assembly comes standard with a high performance maxiFLOWTM heat sink which maximizes convection (air) cooling Comes standard with clean break, reworkable, Chomerics T-766 phase change material FT W L H thermal Performance AIR VELoCITy *Image above is for illustration purposes only. THERMAL RESISTANCE FT/MIN 200 300 400 500 600 700 800 M/S 1.0 1.5 2.0 2.5 3.0 3.5 4.0 C/W (UNDUCTED FLOW) 16.5 13.4 11.6 10.3 9.4 8.7 8.2 C/W (DUCTED FLOW) 12.9 Product Details LENGTH 19 mm Notes: 1) 2) 3) 4) 5) 6) Length and width dimensions refer to the size of the component. Dimensions of the heat sink are subject to tolerances of up to .99 mm in order to accommodate the clip assembly Thermal performance data are provided for reference only. Actual performance may vary by application ATS reserves the right to update or change its products without notice to improve the design or performance Additional tooling fees may be required Typical lead time is a minimum of 4-6 weeks Contact ATS to learn about custom options available WIDTH 19 mm HEIGHT 7.5 mm FIN TIP to FIN TIP 31.5 mm INTERFACE MATERIAL FINISH BLUE-ANODIZED ChOMErICS T766 For more information, to find a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe). REV0_042109 |
Price & Availability of ATS-X50190B-C1-R0
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